A Power Bus With Multiple Via Ground Surface Perturbation Lattices for Broadband Noise Isolation: Modeling and Application in RF-SiP

作者：Hsieh Chia Yuan^*; Wang Chuen De; Lin Kun You; Wu Tzong Lin

来源：IEEE Transactions on Advanced Packaging, 2010, 33(3): 582-591.

DOI：10.1109/TADVP.2009.2036858

• Electromagnetic bandgap (EBG)
• ground bounce noise (GBN)
• high-speed digital circuits
• mixed-signal system
• simultaneous switching noise (SSN)

A model and application of the power bus with multiple via ground surface perturbation lattice (MV-GSPL) is investigated in this paper. A 1-D model especially considering the multiple via effects of the MV-GSPL inside the long period coplanar electromagnetic bandgap power planes (LPC-EBG) is proposed. This model can explain the mechanism of the stopband enhancement and accurately predict the effect of multiple via on the stopband behavior. The accuracy of this model is verified both by full-wave simulation and experiments. Based on this model, a MV-GSPL power/ground pair is designed on a radio-frequency (RF) package for system-in-package (SiP) application. A test C-band LNA fabricated by the TSMC 0.18-mu m 1P6M process is packaged on the MV-GSPL substrate for noise immunity test. Both the chip-package co-simulation and experimental results show excellent power noise isolation capability of the RF-SiP package.

• 出版日期2010-8