A MEMS bubble pump for an electronic cooling device

作者:Suh Junwoo*; Cytrynowicz Debra; Gerner Frank M; Henderson H Thurman
来源:Journal of Micromechanics and Microengineering, 2010, 20(12): 125025.
DOI:10.1088/0960-1317/20/12/125025

摘要

A MEMS bubble pump utilizing the explosive propulsion of vapor as a driving force to circulate a working fluid was considered and constructed to demonstrate its feasibility as a MEMS pump-thermal control device. This device can dissipate waste heat without any external pump or mechanical moving parts through the utilization of a porous silicon wick, which acts as a one-way valve. With respect to thermal control, it demonstrated a heat dissipation capability of approximately 18.5 W cm(-2) in a closed loop configuration. As a MEMS pump, it exhibited excellent potential and demonstrated a pumping capacity up to 2.04 ml min(-1).

  • 出版日期2010-12