Analysis on interfacial reaction of Ni/Sn/Cu solder joint under temperature gradient

作者：Qi, Lin; Wei, Guoqiang^*; Liu, Henglin

来源：Transactions of the China Welding Institution, 2017, 38(10): 71-74.

DOI：10.12073/j.hjxb.20151210004

• Cu substrate
• EDS analysis
• Growth behavior
• Interfacial IMC
• Interfacial intermetallics
• Loading time
• Solder joints
• Thermomigration

The growth behaviors of the interfacial intermetallic compounds (IMCs) in Ni/Sn/Cu solder joints with Ni as hot end and Cu as cold end were systematically investigated under a temperature gradient of 1 046℃/cm without any electromigration. The result showed that the thicknesses of IMC at both cold and hot end increased with loading time under thermomigration, and the growth rate of IMC at cold end was larger than hot end. It was also indicated that the IMC was the (Cu, Ni)6Sn5phase, and the Ni content at hot end was higher than cold end by EDS analysis. In addition, a large number of voids were observed in the interfacial (Cu, Ni)6Sn5phase at cold end, and no Cu3Sn phase was observed between the interfacial (Cu, Ni)6Sn5and Cu substrate.

• 出版日期2017-10-25
• 单位华南理工大学