科研之友
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摘要
This study investigates the effects of conventional sintering and hybrid microwave sintering techniques on the microstructure evolution and tensile properties of a Sn-Ag-Cu solder. A significant energy saving of up to 99% was achieved using the hybrid microwave assisted sintering approach. Hybrid microwave sintered samples exhibited better densification (in terms of lower porosity level) and this indicates the ability of microwaves to sinter solder materials more effectively. Furthermore, tensile results revealed that samples hybrid microwave sintered at 210 degrees C exhibited the best enhancement in yield strength and ultimate tensile strength, with no compromise in the failure strain, as compared with other widely used commercial solders. The morphology of pores and interparticle spacing were observed to be the two key factors influencing the mechanical properties of the solders.
- 出版日期2009-1-7
