A Low Power Online Test Method for FPGA Single Solder Joint Resistance

作者：Wang, Nantian^*; Ma, Xiaoyu; Xu, Xiaobin; Rui, Ziqiao

来源：Journal of Electronic Testing-Theory and Applications, 2017, 33(6): 775-780.

DOI：10.1007/s10836-017-5698-1

• Prognostics and system health management (PHM)
• Field programmable gate array (FPGA)
• Solder joint
• Resistance test
• Fault detection
• Low power consumption

Solder joint resistance monitoring is important for electronic system prognostics and system health management. It is noted that the typical built-in self-test method of FPGA solder joint has shortcomings of large power consumption, unavailability of test pins in FPGA's functional design and possible difficulty in location arrangement of solder joint when two pins need to be measured simultaneously. To overcome these drawbacks, an online measuring method for single solder joint resistance with the constraints of limited pin number and low power consumption is proposed. The test model of the method is introduced in detail and the power consumption is theoretically analyzed. Furthermore, corresponding experimental platform is built based on a Spartan 6 FPGA and experiments are conducted. The test results show that the method can be used for online measurement of a solder joint's resistance of an output pin in an FPGA design with very low power consumption.

• 出版日期2017-12
• 单位中国空气动力研究与发展中心; 中国人民解放军重庆通信学院