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摘要
A theoretical model is developed to account for the effects of strain rate and temperature on the deformation behavior of ultrafine-grained fcc Cu. Three mechanisms, including dislocation slip, grain boundary diffusion, and grain boundary sliding are considered to contribute to the deformation response simultaneously. Numerical simulations show that the strain rate sensitivity increases with decreasing grain size and strain rate, and that the flow stress and tensile ductility increase with either increasing strain rate or decreasing deformation temperature.
- 出版日期2011
- 单位温州大学
