A Die-Selection Method Using Search-Space Conditions for Yield Enhancement in 3D Memory

作者：Lee Joohwan; Park Kihyun; Kang Sungho^*

来源：ETRI Journal, 2011, 33(6): 904-913.

DOI：10.4218/etrij.11.0111.0108

• Yield enhancement
• 3D memory
• 3D memory stacking
• inter-die redundancy
• die-selection method

Three-dimensional (3D) memories using through-silicon vias (TSVs) as vertical buses across memory layers will likely be the first commercial application of 3D integrated circuit technology. The memory dies to stack together in a 3D memory are selected by a die-selection method. The conventional die-selection methods do not result in a high-enough yields of 3D memories because 3D memories are typically composed of known-good-dies (KGDs), which are repaired using self-contained redundancies. In 3D memory, redundancy sharing between neighboring vertical memory dies using TSVs is an effective strategy for yield enhancement. With the redundancy sharing strategy, a known-bad-die (KBD) possibly becomes a KGD after bonding. In this paper, we propose a novel die, selection method using KBDs as well as KGDs for yield enhancement in 3D memory. The proposed die-selection method uses three search-space conditions, which can reduce the search space for selecting memory dies to manufacture 3D memories. Simulation results show that the proposed die-selection method can significantly improve the yield of 3D memories in various fault distributions.

• 出版日期2011-12