A novel method to measure the sidewall angle of MEMS structures

作者：Qin, Qiang; Zhao, Qiancheng; Yang, Fang; Zhang, Dacheng; Yan, Guizhen

来源：16th IEEE SENSORS Conference, ICSENS 2017, 2017-10-30 To 2017-11-01.

DOI：10.1109/ICSENS.2017.8233950

• Critical problems
• Micro electro mechanical system
• Micro resonators
• Micro-mechanical
• Microscopic measurement
• Optical profiler
• Out-of-plane motion
• Sidewall angles

A good profile of the sidewall in key structure of MEMS (Micro-electromechanical Systems) is becoming a critical problem to enhance the performance. Therein, measurement of the sidewall angle has the direct bearing on the improvement of process and design of structures. This paper presents a novel method to measure the sidewall angle. Compared with the traditional method-microscopic measurement, this approach only requires a simple microstructure based on a micromechanical latch switch and an optical profiler. By means of measuring the out-of-plane motion of the structure, the angle of the sidewall can be calculated. In addition, positive or negative sign of this angle can be deduced from the relevance of the directions between the load and the out-of-plane motion. The effectiveness of this method is verified by simulations and experiments.

• 出版日期2017
• 单位北京大学