摘要

Most of the technologically relevant abrasive machining techniques for silicon (Si) such as lapping, sawing and grinding are based on the interaction of the silicon surface with a hard particle or asperity. It has been long established that the governing deformation mechanism for Si under such contact loading conditions is stress induced phase transformation. The present work introduces a novel phenomenological constitutive model for phase transformations of silicon set up in a thermomechanical framework of broad applicability. Taking into account experimental observations as well as first principle and molecular dynamics calculations, it captures both the cd-Si -> beta-Si transition upon compression and the beta-Si -> a-Si transition upon rapid decompression, which are most relevant for indenter loading. The model was numerically implemented in analogy to incremental plasticity and successfully applied for finite-element (FE) simulations of nanoindentation.

  • 出版日期2012-6-1

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