Ultrasonic powder consolidation of Sn/In nanosolder particles and their application to low temperature Cu-Cu joining

作者：Shu Yang; Hashemabad Somayeh Gheybi; Ando Teiichi; Gu Zhiyong^*

来源：Materials and Design, 2016, 111: 631-639.

DOI：10.1016/j.matdes.2016.09.013

• Ultrasonic powder consolidation (UPC)
• Sn/In nanosolder
• Low temperature soldering
• Cu/Cu joining
• Intermetallic growth
• Thermal aging
• Mechanical properties

Tin/Indium (Sn/In) nanosolder particles in the size range of 40-70 nm were successfully consolidated into nanosolder films by the ultrasonic power consolidation (UPC) method. The consolidated nanosolder film prevents the nanoparticles from oxidation, which is a common problem of nanomaterials during storage and processing, and makes the nanoparticles easier to handle. The quality of the consolidated nanosolders was examined by scanning electron microscopy (SEM), X-ray diffraction (XRD), and differential scanning calorimetry (DSC). The consolidated Sn/In nanosolder films were then used to join copper (Cu) plates at two soldering conditions (high pressure vs. lowpressure). SEM and energy dispersive X-ray spectroscopy (EDS) were used to study the intermetallic compound (IMC) formation and growth during thermal aging. The IMC layer consisted of eta-Cu-6( Sn, In)(5) and no Cu-3(Sn, In) was observed. The thickness of the IMC layer followed a linear relationship with the square root of the aging time, indicating diffusion controlled kinetics. The results indicated that pressure is critical for effective Cu-Cu joining by limiting the IMC growth. Finally, pull tests of the specimen joined by the consolidated nanosolder film under high pressure showed a comparable result with the solder joints formed by Sn/In solders reported in literature.

• 出版日期2016-12-5
• 单位东北大学