摘要

A user-friendly heat-resistant modified polymer-based adhesive was developed to join C/C composites. After calcination at 1300 degrees C, the bonding effect of the adhesive reached the highest as more heat-resistant ceramics and high-temperature melting glass were generated in the adhesive. Its bonding strength was kept above 15 MPa during test from RT to 500 degrees C and the corresponding joints ruptured at C/C substrates. Besides, after repeated thermal-cycling at 1300 degrees C, the bonding strength at this temperature was maintained at about 12 MPa. For cured adhesive without calcination, its bonding strength could be maintained above 5 MPa during the whole heating process, which made it to have direct application in practice after curing.