A novel metallization process for soldering graphite to copper at low temperature

作者:Song, X. G.*; Chai, J. H.; Hu, S. P.; Cao, J.; Feng, J. C.; Tang, D. Y.
来源:Journal of Alloys and Compounds, 2017, 696: 1199-1204.
DOI:10.1016/j.jallcom.2016.12.104

摘要

A defect-free Sn-based metallization layer was prepared successfully on the surface of graphite at 950 degrees C for 30 min using Sn0.3Ag0.7Cu-9% Cr (wt. %) metal powders. The typical interfacial microstructure of the metallization interface was b-Sn/Cr3C2/graphite. The formation mechanism of Cr3C2 reaction layer was investigated in detail. Reliable soldered joint of metallized graphite to copper was achieved using Sn3Ag0.5Cu solder paste at 250 degrees C for 60 s in air, and the average shear strength of soldered joint reached 25 MPa. The novel metallization method provides a neoteric way for joining graphite and copper.