Mid-Infrared Waveguide Array Inter-Chip Coupling Using Optical Quilt Packaging

作者：Ahmed Tahsin^*; Lu Tian; Butler Thomas P; Kulick Jason M; Bernstein Gary H; Hoffman Anthony J; Hall Douglas C; Howard Scott S

来源：IEEE Photonics Technology Letters, 2017, 29(9): 755-758.

DOI：10.1109/LPT.2017.2684091

• Mid-infrared
• optical coupling
• Ge-on-Si
• quantum cascade laser

A MEMS-based mid-infrared (MIR) chip-to-chip optical coupling technique, optical quilt packaging (OQP), is described. Numerical simulations are performed to predict performance and establish fabrication tolerances. The OQP fabrication process is described in detail and MIR inter-chip optical coupling between two waveguide arrays joined by OQP is characterized. The coupling loss between Ge-on-Si passive MIR waveguides is found to be similar to 4.1 dB, which is the lowest butt-coupling loss reported between two chips.

• 出版日期2017-5-1