A novel low inductive 3D SiC power module based on hybrid packaging and integration method

作者：Huang Zhizhao; Li Yuxiong; Chen Lichuan; Tan Yifan; Chen Cai; Kang Yong; Luo Fang

来源：9th Annual IEEE Energy Conversion Congress and Exposition, ECCE 2017, 2017-10-01 To 2017-10-05.

DOI：10.1109/ECCE.2017.8096698

• Flexible printed circuit
• Flexible printed circuit boards
• Impedance analyzer
• Integration method
• Overshoot voltage
• Packaging structure
• Parasitic inductances
• Power module

This paper presents a 1200 V, 120 A SiC phase-leg power module built in a novel low inductive 3D hybrid structure. The power module consists of DBC substrate and Flexible Printed Circuit (FPC) board equipped with SiC MOSFETs and diodes. The parasitic inductance of the power module is significantly minimized by using the FPC board and the proper layout design to 0.79 nH (extracted by Q3D). The power terminals are directly extended from the FPC board with only 0.85 nH stray inductance, and the DC decoupling capacitors are integrated in the module to decrease the peak turn-off voltage. The parasitic inductance of the module is verified by Impedance Analyzer measurement. Meanwhile, the double pulse test results show the switching speed of the FPC module is 1.6 times faster and has only half the overshoot voltage when compared with the commercial module. By integrating gate drivers, DC-link, and heatsink, the designed full SiC phase-leg 3D module has the potential to improve the power density.

• 出版日期2017
• 单位华中科技大学; University of Arkansas, Fayetteville