A Study of the Colloidal Stability of Mixed Abrasive Slurries and Their Role in CMP

作者:Lin F*; Nolan L; Xu Z; Cadien K
来源:Journal of the Electrochemical Society, 2012, 159(5): H482-H489.
DOI:10.1149/2.jes113470

摘要

Composite particles for Chemical Mechanical Polishing (CMP) have the potential to allow users to tailor slurries to their specific needs. In this work, we present a simple approach to creating self-assembled composite particles consisting of a silica core and ceria shell. The particles are designed to maximize their 'chemical tooth' against silicon oxide. We propose a mechanism for the assembly of these particles and present a mathematical model of their overall surface charge. This model agrees well with experimental analysis of the particle zeta-potential and settling behaviour. The composite particles are used to polish PECVD silicon oxide. A twenty-fold increase in oxide polish rate is observed when using the composite particles, compared to polishing with either silica or ceria alone.

  • 出版日期2012