A numerical study of failure of an adhesive joint influenced by a void in the adhesive

作者：Sengab Ahmed; Talreja Ramesh^*

来源：Composite Structures, 2016, 156: 165-170.

DOI：10.1016/j.compstruct.2015.12.052

• Adhesive joints
• Interface cracking
• Crack kinking
• Single lap joint
• Manufacturing voids

This study examines the effect of manufacturing induced voids on failure of adhesive joints. A single lap joint with preexisting crack between the adherend and the adhesive is considered and the crack growth behavior is studied in the presence of a void in the adhesive. The analysis conducted is numerical using finite elements and a revised virtual crack closure technique for calculating the energy release rate of the interface crack. After verifying the numerical model for a case where analytical solution exists, it is used to gain insight into the failure of the adhesive joint by conducting a parametric study where the size, shape and location of the void with respect to the crack tip are varied. The case of two preexisting cracks on opposite interfaces in the presence of a void is also examined. Published by Elsevier Ltd.

• 出版日期2016-11-15