Au-Sn SLID Bonding: A Reliable HT Interconnect and Die Attach Technology

作者：Tollefsen Torleif Andre^*; Larsson Andreas; Taklo Maaike Margrete Visser; Neels Antonia; Maeder Xavier; Hoydalsvik Kristin; Breiby Dag W; Aasmundtveit Knut

来源：Metallurgical and Materials Transactions B-Process Metallurgy and Materials Processing Science, 2013, 44(2): 406-413.

DOI：10.1007/s11663-012-9789-1

Au-Sn solid-liquid interdiffusion (SLID) bonding is an established reliable high temperature (HT) die attach and interconnect technology. This article presents the life cycle of an optimized HT Au-Sn SLID bond, from fabrication, via thermal treatment, to mechanical rupture. The layered structure of a strong and uniform virgin bond was identified by X-ray diffraction to be Au/zeta (Au0.85Sn0.15)/Au. During HT exposure, it was transformed to Au/beta (Au1.8Sn0.2)/Au. After HT exposure, the die shear strength was reduced by 50 pct, from 14 Pa to 70 MPa, which is still remarkably high. Fractographic studies revealed a change in fracture mode; it was changed from a combination of adhesive Au/Ni and cohesive SiC fracture to a cohesive beta-phase fracture. Design rules for high quality Au-Sn SLID bonds are given.

• 出版日期2013-4