科研之友
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摘要
This paper describes a packaged and fiber array coupled 4 x 4 optical crosspoint switch designed for optical packet switching. Alignment and fixation techniques of two perpendicular fiber arrays to the integrated InP-based switch chip have been developed. Thermal management is also included in the packaging. The packaged devices demonstrate long-term stability and have been used in switch modules, including the packaged device and electronic interfaces.
- 出版日期2005-12
