Adhesion investigation of low-k films system using 4-point bending test

作者：Lee Chang Chun^*; Huang Jacky; Chang Shu Tong; Wang Wei Ching

来源：Thin Solid Films, 2009, 517(17): 4875-4878.

DOI：10.1016/j.tsf.2009.03.135

• 4-point bending
• Interfacial crack
• FEA
• Adhesion
• Thin film

This research presents a simulation-based methodology to accurately predict interfacial adhesion behaviors of heterostructures. Validation of the proposed approach is achieved through comparison of 4-point bending test results on interfaces of multiple stacked low-k films with those of theoretical solutions from the finite element analysis. Impact induced by the compliance of 4-point bending test system can be neglected using the averaged energy release rate of various crack lengths in simulations. On the basis of precise predictions drawn from the considered analyses, uncertainty of experimental tests for the nano-scale fractured strength could be promptly observed and estimated.

• 出版日期2009-7-1