A PEEC with a new capacitance model for circuit simulation of interconnects and packaging structures

作者：Cao, Y^*; Li, ZF; Mao, JF; Mao, JF

来源：IEEE Transactions on Microwave Theory and Techniques, 2000, 48(2): 281-287.

DOI：10.1109/22.821777

• integrated circuit
• interconnect and packaging
• Lorentz gauge
• PEEC
• state equations

In this paper, a modified partial-element equivalent-circuit (PEEC) model, i.e., (L-P,(A) over right arrow,R,epsilon(f))PEEC, is introduced. In such a model, no equivalent circuit, but a set of state equations for the variables representing the function of circuit, are given to model a three-dimensional structure. Unlike the original (L-P, P, R, epsilon(f))PEEC model, the definition of vector potential A with integral form and the Lorentz gauge are used in expanding the basic integral equation instead of the definition of the scalar potential phi with integral form. This can directly lead to the state equations, and the capacitance extraction can be replaced by the calculation of the divergence of (A) over right arrow, which is analytical. For analysis of most interconnect and packaging problems, generally containing complex dielectric structures, the new model can save a large part of computing time. The validity of the new model is verified by the analysis in time and frequency domain with several examples of typical interconnect and packaging structures, and the results with this new method agree well with those of other papers.

• 出版日期2000-2
• 单位上海交通大学