Application of ultrasonic assisted soldering method to hard-to-solder material

作者：Yonekura Daisuke^*; Ueki Tomoyuki; Taguchi Yuki

来源：International Journal of Modern Physics B, 2018, 32(19): 1840054.

DOI：10.1142/S0217979218400544

• Ultrasonic assisted soldering
• Pb-free solder
• interface
• fused quartz
• soda-lime glass

In this study, Pb-free solders were bonded to soda-lime glass and fused quartz plates using the ultrasonic assisted soldering (UAS) method. The solder-glass interfaces were observed and analyzed to clarify the effect of the elements in the solder and glass bonding behavior. As a result, the Sn-Zn solder was bonded to glass without the intermetallic compound (IMC) layer. However, the Sn-Ag-Cu solder was not able to bond to glass even though ultrasonication was performed during the soldering process. Chemical shifts for Zn 2p and O 1s spectra were observed at the interface by X-ray photoelectron spectroscopy (XPS) analysis, which is attributed to the chemical bonding between the substrates and elements in solder alloy. In conclusion, O in the substrate and Zn in the solder were important to form the bond between the glass and solder.

• 出版日期2018-7-30