A moving thermal dielectric crack in piezoelectric ceramics with a shearing force applied on its surface

作者：Zhou, Y-T; Kim, T-W^*

来源：Applied Mathematical Modelling, 2018, 63: 1-17.

DOI：10.1016/j.apm.2018.06.016

• Thermal dielectric
• Moving crack
• Shearing force
• Analytical expressions
• Critical crack velocity

This article conducts an exact analysis of a thermal dielectric crack moving in piezoelectric materials. Self-generating thermal and electric loadings by the crack interior are exerted on the crack surfaces as well as various external loadings including a shearing force. Fundamental solutions of the thermal and electro-elastic coupling fields are given by determining a temperature function and a harmonic function with eigenvalues properties due to material properties considered. Analytical expressions are obtained benefiting evaluation of key parameters. Numerical analysis is done and some interesting observations are found. There is a critical crack velocity within and beyond which the electric loading exerts different influences on the thermal flux of crack interior and the thermal stress intensity factor.

• 出版日期2018-11
• 单位同济大学