Adhesive bonding of microfluidic chips: influence of process parameters

作者：Riegger Lutz^*; Strohmeier Oliver; Faltin Bernd; Zengerle Roland; Koltay Peter

来源：Journal of Micromechanics and Microengineering, 2010, 20(8): 087003.

DOI：10.1088/0960-1317/20/8/087003

In this note, the influence of process parameters for adhesive bonding as a versatile approach for the sealing of polymer microfluidic chips is investigated. Specifically, a process chain comprising pre-processing, adhesive transfer as well as post-processing is presented and parameter recommendations are provided. As a device for adhesive transfer, a modified laminator is utilized which transfers thin layers of adhesive onto the chip surface, only via a silicone roll. Using this device and a high temperature (T(g) > 100 degrees C) epoxy adhesive, adhesive layers in the range of 2-4 mu m can be reproducibly transferred (CV < 4%). For best bonding results, it is recommended to provide 2.5 mu m thin layers of adhesive in combination with a subsequent evacuation step at 10 mbar for 3 h. Further, it is proposed to integrate capture channels near large, featureless areas to compensate for variations in processing and thus prevent clogging of channels.

• 出版日期2010-8