Hybrid On-Chip/In-Package Integrated Antennas for Millimeter-Wave Short-Range Communications

作者：Luna Jose A Zevallos^*; Dussopt Laurent; Siligaris Alexandre

来源：IEEE Transactions on Antennas and Propagation, 2013, 61(11): 5377-5384.

DOI：10.1109/TAP.2013.2279832

• 60 GHz
• integrated antennas
• millimeter-wave antennas
• packaging
• system-in-package
• system-on-chip

A hybrid on-chip/in-package integrated antenna is designed and demonstrated for the first time in a QFN ( quad flat no lead)-packaged 60-GHz ultra-wide-band ( UWB) low-power transceiver. The on-chip radiating element is a folded dipole antenna realized on the transceiver high-resistivity silicon chip ( CMOS-SOI technology). It is coupled electromagnetically to a patch antenna embedded under the package lid. The design was performed with a full 3D EM model of the packaged transceiver. The experimental radiation patterns and gain values are in agreement with the simulations, they show an antenna gain up to 4.6-8 dBi at 60 GHz and a 3-dB beamwidth 43 degrees x 72 degrees, suitable for short-range low-power Gbps communications.

• 出版日期2013-11
• 单位中国地震局