Limit for thermal transport reduction in Si nanowires with nanoengineered corrugations

作者：Sullivan Sean E^*; Lin Keng Hua; Avdoshenko Stanislav; Strachan Alejandro

来源：Applied Physics Letters, 2013, 103(24): 243107.

DOI：10.1063/1.4844995

Non-equilibrium molecular dynamics simulations reveal that the thermal conductance of Si nanowires with periodic corrugations is lower than that of smooth wires with cross-sections equivalent to the constricted portions. This reduction in conductance is up to 30% and tends to plateau with increasing corrugation height. Spatially resolved temperature and heat current maps provide a microscopic understanding of this effect; we find that 80% of the heat current is carried through the constricted area even for high-amplitude corrugations. More importantly, we show that temperature gradient inversion and heat current vortices at the ridge peaks establish fundamental limits on maximum conductance reduction.

• 出版日期2013-12-9