Bonding characteristics during very high power ultrasonic additive manufacturing of copper

作者：Sriraman M R^*; Babu S S; Short M

来源：Scripta Materialia, 2010, 62(8): 560-563.

DOI：10.1016/j.scriptamat.2009.12.040

• Ultrasonic additive manufacturing
• Welding
• Electron backscattering diffraction
• Copper
• Dynamic recrystallization

Welding of copper foils (150 mu m thick) achieved at room temperature by very high power ultrasonic additive manufacturing was seen to involve appreciable softening and enhanced plastic flow. The initial coarse-grained structure (25 mu m) in the material changed into fine dynamically recrystallized grains (0.3-10 mu m) at the foil interface within the order of a few milliseconds of processing. This phenomenon led to metallurgical bonding through grain boundary migration and allowed for successive welding of tapes to form a three-dimensional part.

• 出版日期2010-4