Antenna-in-package system integrated with meander line antenna based on LTCC technology

作者：Dong, Gang^*; Xiong, Wei; Wu, Zhao-yao; Yang, Yin-tang

来源：Frontiers of Information Technology and Electronic Engineering, 2016, 17(1): 67-73.

DOI：10.1631/FITEE.1500167

• Antenna-in-package (AiP)
• Meander line antenna
• Multi-chip module (MCM)
• Low temperature co-fired ceramic (LTCC)

We present an antenna-in-package system integrated with a meander line antenna based on low temperature co-fired ceramic (LTCC) technology. The proposed system employs a meander line patch antenna, a packaging layer, and a laminated multi-chip module (MCM) for integration of integrated circuit (IC) bare chips. A microstrip feed line is used to reduce the interaction between patch and package. To decrease electromagnetic coupling, a via hole structure is designed and analyzed. The meander line antenna achieved a bandwidth of 220 MHz with the center frequency at 2.4 GHz, a maximum gain of 2.2 dB, and a radiation efficiency about 90% over its operational frequency. The whole system, with a small size of 20.2 mmx6.1 mmx2.6 mm, can be easily realized by a standard LTCC process. This antenna-in-package system integrated with a meander line antenna was fabricated and the experimental results agreed with simulations well.

• 出版日期2016-1
• 单位西安电子科技大学