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摘要
Three dimensional integration using Through-Silicon Vias (TSVs) offers short inter-layer interconnects and higher packing density. In order to take advantage of these attributes, a novel hybrid 3D NoC-Bus architecture is proposed in the paper. For vertical link, a Fake Token Bus architecture is elaborated, which utilizes the bandwidth efficiently by updating token synchronously. Based on this bus architecture, a methodology of hybrid 3D NoC-Bus design is introduced. The network hybridizes with the bus in vertical link and distributes long links of the full connected network into different layers, which achieves a network with a diameter of only 3 hops and limited radix. In addition, a congestion-aware routing algorithm applied to the hybrid network is proposed. The algorithm routes packets in horizontal firstly when the bus is busy, which balances the communication and reduces the possibility of congestion. Experimental results show that our network can achieve a 34.4% reduction in latency and a 43% reduction in power consumption under uniform random traffic and a 36.9% reduction in latency and a 48% reduction in power consumption under hotspot traffic over regular 3D mesh implementations on average.
