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摘要
Diffusion bonding of U-Al sheets of micrometers in thickness by hot pressing in vacuum was carried out at different temperatures, pressures and for different holding time. The bonding interface was characterized by microscopic analysis, energy spectrum analysis and nanoindentation test. Results show that the appropriate process parameters without diffusion layer are 350 degrees C/63 MPa/1 h. Under the precondition of 1 h holding time, the process parameters for homogeneous diffusion layer are 400 degrees C/80 MPa. The composition of homogeneous diffusion layer is mainly UAl2.
- 出版日期2016-7
- 单位中国工程物理研究院
