A Study on Positive Photosensitive Epoxy Resins Using Reaction Development Patterning (RDP)

作者：Zhou Wei Min^*; Fukushima Takafumi; Tomoi Masao; Oyama Toshiyuki

来源：Journal of Photopolymer Science and Technology, 2014, 27(6): 713-717.

DOI：10.2494/photopolymer.27.713

• photosensitive epoxy resin
• reaction development patterning
• RDP
• positive patterns

In this study, we successfully fabricated positive photosensitive epoxy resins based on the Reaction Development Patterning (RDP) by using B-staged polymers prepared by polyaddition between an epoxy base resin and an acid anhydride curing agent during mixing and prebaking processes. Application of RDP to the B-staged polymers afforded positive fine patterns by the use of 15-mol% sodium 2-aminoethoxide in ethanolamine / NMP mixtures. Furthermore, the fine epoxy patterns were not deformed after heat treatment for complete curing, indicating that the cress-linked epoxy patterns have high tolerability to thermal stresses. These results suggest the possibility of practical application of RDP-based positive photosensitive epoxy resins.

• 出版日期2014