Directly Modulated Laser Diode Module Exceeding 10 Gb/s Transmission

作者：Song Jeong Hwan^*; Rensing Marc; Daunt Chris L L M; O'Brien Peter; Peters Frank H

来源：IEEE Transactions on Components Packaging and Manufacturing Technology, 2011, 1(6): 975-980.

DOI：10.1109/TCPMT.2011.2129572

• Impedance matching
• microstrip line
• optical coupling
• optoelectronic module
• photonics packaging

A directly modulated laser diode module with over 10 Gb/s transmission and its performance, packaging process, and manufacturability are presented. The butterfly package consists of a V-connector, heat sink, and L-shaped microstrip line (MSL) which includes an integrated impedance matching resistor. The optical system consists of a 1.3-mu m distributed feedback laser and a micro lens with isolator. A large modulation bandwidth of up to 15 GHz was obtained, and the eye diagram for 10 Gb/s modulation was clearly visible. Importantly, using an L-shaped MSL with integrated impedance matching resistor design, the module design is significantly simplified and can provide flexibility to insert various optical coupling systems. Moreover, since the laser was mounted directly on Kovar heat sink, optical output power reduction by thermal effects was 1 dB up to 50 degrees C without active cooling. As a result of the simplified module configuration with flexibility, the module packaging process may be highly efficient for mass production.

• 出版日期2011-6