Microstructure evolution and electrical property improvement of Mn-based thin film thermistors with the sandwich structure

作者：He, L^*; Ling, Z Y; Wu, M Y; Zhang, G; Ling, D X; Liu, M X; Yang, L

来源：Journal of Materials Science: Materials in Electronics , 2015, 26(8): 6314-6318.

DOI：10.1007/s10854-015-3218-6

• Cross-sectional morphology
• Crystalline structure
• High sensitivity
• Micro-structure evolutions
• Multilayer structures
• Property improvement
• Temperature behavior
• Thin film thermistor

Mn1.85Co0.3Cu0.3Ni0.55O4 (MCCN), Mn1.85Co0.3Ni0.85O4 (MCN) thin film and MCN-MCCN-MCN sandwich structural thermistors were prepared on Pt/TiO2/Ti/SiO2/Si substrates by sol-gel technique. The crystalline structure, surface and cross-sectional morphologies of the prepared thermistors were analyzed by XRD and FESEM, respectively. The electric properties, such as the resistivity-temperature behaviors, sensitivity, stability, and dielectric constant, were investigated in detail. Compared with the MCCN and MCN thin film thermistors, the MCN-MCCN-MCN sandwich structural thermistor showed good microstructure, low resistivity, high sensitivity, small aging coefficient and moderate dielectric constant. The results showed that the multi-layer structure was an effective way to improve and adjust the properties of NTC thin film thermistors.

• 出版日期2015-8
• 单位东莞理工学院; 华南理工大学