Bond strength of W-Cu/CuCr integrated material

作者：Fan Zhi Kang^*; Liang Shu Hua; Xue Xu

来源：Transactions of Nonferrous Metals Society of China, 2001, 11(6): 835-837.

• Copper chromium alloys
• Integrated materials
• Tungsten chromium alloys
• Tungsten copper alloy

The bond strength of W-Cu/CuCr integrated material was investigated. The results show that the fracture of W-Cu/CuCr integrated material often takes place at W-Cu/CuCr interface. Some alloying elements enhance the bond of W and CuCr alloy, which results in the increase of the strength of the W-Cu/CuCr interface. The fracture of the W-Cu/CuCr integrated material occurs in the CuCr alloy part, not at the W-Cu/CuCr interface. Chromium in CuCr alloy part of the integrated material can improve Cr diffusing from the CuCr alloy to W-Cu composite and can be alloyed (near the W-Cu/CuCr interface) in the W-Cu composite. Thus the strength of W-Cu/CuCr interface increase.

• 出版日期2001