Analysis of pattern height development in hot embossing process

作者:He Yong; Fu Jian Zhong*; Chen Zi Chen
来源:Microsystem Technologies, 2009, 15(7): 963-968.
DOI:10.1007/s00542-009-0858-6

摘要

The pattern height of hot embossing was analyzed based on the polymer power-law material assumption for better controlling product quality. The time development of the polymer substrate height, pattern height and the imprint pressure were obtained. The imprint temperature with respect to the pattern height was discussed. Theory analysis shows that in a constant imprint pressure, the pattern height has a power relationship with the imprint time. At the beginning imprint stage, as for the elastic response of polymer, the pattern height increases rapidly. With the time increasing, the polymer deform is mainly caused by creep and this results in low imprint speed. On the other hand, the increasing friction force between the polymer and the mold will further reduce the imprint speed. The theoretical data were compared with experiments and the results show that this model can well predict the rule of polymer substrate thickness variation.

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