摘要

The continuous development of electronic devices requires optimum solutions for heat dissipation. This prompts the needs to the development of novel polymer composites that possess high thermal conductivity and high electrical resistivity. This paper discusses the challenges in this research area and some potential strategies to solve the problems. In this work, a thermal conductivity analyzer was designed and implemented to measure the effective thermal conductivity of composites with heterogeneous structures. An analytical model was developed to simulate the effect of contents of spherical fillers on the effective thermal conductivity of the composites. Using the developed model, together with experimentally-measured effective thermal conductivity of various composites, a semi-empirical approach was developed to estimate the thermal interfacial resistance at the polymer-filler interface.

  • 出版日期2013-2

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