Accelerated test for board level solder interconnects reliability using vibration shock loading

作者：Liu Yang; Zhang Hong Wu; Sun Feng Lian^*; Zhou Zhen; Qin Yong

来源：Journal of Vibration and Shock, 2013, 32(7): 74-77+112.

• Alternative methods
• Board-level
• Fatigue characteristics
• High speed data acquisition system
• Repetition frequency
• Solder interconnects
• Vibrating conditions
• Vibration shock

An accelerated test was designed for evaluating vibration shock resistance of board level solder interconnects. Vibration was loaded upon PCB level in sinusoidal wave mode with single frequency. Vibrating condition was adjusted to simulate drop impact loading amplitude. Loading intensities were characterized using strain measurements. The solder failure process was recorded with a high speed data acquisition system. Results showed that a similar loading intensity of drop impact can be obtained using vibration shock method; the loading repetition frequency of vibration shock is higher than that of drop impact; solder interconnects reveal fatigue characteristic during accelerated failure test; the accelerated test raises the test efficiency with keeping failure mode; hence, it can be an alternative method for board level shock reliability evaluation.

• 出版日期2013
• 单位哈尔滨学院