An Analytical Approach to Determine the Pressure Distribution During Chemical Mechanical Polishing

作者：Ludwig Christian^*; Kuna Meinhard

来源：Journal of Electronic Materials, 2012, 41(9): 2606-2612.

DOI：10.1007/s11664-012-2151-1

• Chemical mechanical polishing
• planarization
• multizone carrier

During chemical mechanical polishing the distribution of wear is primarily affected by the pressure distribution on the wafer surface. Moreover, understanding the effects that influence the contact pressure plays a key role in improving the process quality. In this paper a multizone chuck is considered. Two ways to calculate the distribution of contact pressure between wafer and pad are shown. First, an analytical approach is presented, which uses the plate theory to describe the behavior of the carrier. Secondly, a finite-element simulation, which is able to handle more details, is performed to verify that the included assumptions have a negligible impact on the results. It is found that both approaches produce similar results. The reasons for the differences can be explained.

• 出版日期2012-9