A SPICE COMPATIBLE MODEL OF ON-WAFER COUPLED INTERCONNECTS FOR CMOS RFICS

作者：Shi X^*; Yeo K S; Lim W M; Do M A; Boon C C

来源：Progress in Electromagnetics Research-Pier, 2010, 102: 287-299.

DOI：10.2528/PIER10010608

This paper investigates the properties of the on-wafer coupled interconnects built in a 0.18 mu m CMOS technology for RF applications. A SPICE compatible equivalent circuit model is developed. The proposed model is an extension of a 2-Pi equivalent circuit model for single-line interconnects by adding two coupling components. The model parameters are extracted from four-port S-parameter simulation results through a calibrated electromagnetic (EM) simulator, i.e. HFSS. The accuracy of the model is validated from 500 MHz to 20 GHz.

• 出版日期2010
• 单位南阳理工学院