Modelling and investigation of material removal profile for computer controlled ultra-precision polishing

作者:Ren, Lijuan; Zhang, Guangpeng*; Zhang, Lu; Zhang, Zhen; Huang, Yumei
来源:Precision Engineering-journal of the International Societies for Precision Engineering and Nanotechnology, 2019, 55: 144-153.
DOI:10.1016/j.precisioneng.2018.08.020

摘要

Computer controlled ultra-precision polishing (CCUP) is widely used for high-precision surface finish processing with high form accuracy and good surface finish. CCUP is a deterministic material removal process based on the surface error-profile and the removal characteristic of the polishing tool. Material removal profile is often used to characterize the material removed in polishing process. Deviation phenomenon is a newly detected feature of the material removal profile which may contribute to the non-negligible form error of the polished surface. In this paper, the material removal model is established on the basis of Preston equation to obtain a better understanding of the characteristics of material removal in surface polishing. Firstly, contact stress model is established using Hertz contact theory. Then, relative velocity in the contact area is analyzed using geometric methods which can directly reflect the difference of the velocity of points in the contact area. Finally, single factor analysis and Taguchi method are used to investigate the influence of polishing parameters on the deviation feature of material removal profile and to provide a way for parameter optimization. The simulation and experiment results indicate that the proposed method can describe the deviation features well and parameter optimization strategies are provided in the conclusions.