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摘要
An analytical approach is used to investigate the SH-wave scattering problems of the bi-material half-space including a circular inclusion embedded and an interfacial crack. Considering the multiple scattering phenomena between the boundaries and the circular inclusion, the "image" principle is used to establish the expressions of the wave field. With the aid of interfacial conjunction, the interfacial crack is constructed. According to the displacement and stress continuity conditions, the Fredholm integral equations of the first kind are obtained to determine the unknown forces attached to the linking sections. Finally, analytical expressions for dynamic stress intensity factors are obtained. The numerical results for dynamic stress intensity factors are presented graphically considering the factors of the crack length, the incident wave number, the inclusion defect and the different media parameters.
