Application of two-dimensional layered hexagonal boron nitride in chip cooling

作者：Bao Jie; Zhang Yong; Huang Shirong; Sun Shuangxi; Lu Xiuzhen; Fu Yifeng; Liu Jianying^*

来源：Journal of Basic Science and Engineering, 2016, 24(1): 210-217.

DOI：10.16058/j.issn.1005-0930.2016.01.020

• Hexagonal boron nitride
• Hexagonal boron nitride (h-BN)
• Infrared thermal imager
• Physicochemical property
• Resistance-temperature curves
• Single layer
• Thermal evaluations
• Two-dimensional materials

Research into layered hexagonal boron nitride(h-BN)has recently intensified, due to its superior physicochemical properties compared to that of a typical two-dimensional material. H-BN can be utilized in power chips as both an insulating layer as well as a heat spreader for local hotspots with high heat flux. Single layer h-BN film grown by CVD and h-BN microparticles are respectively transferred onto the surfaces of the thermal evaluation chips, where the influence of h-BN on the heat dissipation performance of the chips can be observed at different power values. The resistance-temperature curve method and infrared thermal imager are both used to measure the temperature of hotspots on the thermal evaluation chips, which can be reduced by between 3~5 at 1W after the transfer of h-BN. The cooling efficiency is improved and it can be found that single layer h-BN film shows better heat dissipation ability.

• 出版日期2016
• 单位上海大学