Analysis of grit interference mechanisms for the double scratching of monocrystalline silicon carbide by coupling the FEM and SPH

作者：Duan, Nian; Yu, Yiqing; Wang, Wenshan; Xu, Xipeng^*

来源：International Journal of Machine Tools and Manufacture, 2017, 120: 49-60.

DOI：10.1016/j.ijmachtools.2017.04.012

• Interference mechanism
• Double scratching
• Coupled FE and SPH method
• Distance of two diamond grits in the Y-direction

Three-dimensional twice scratching and double scratching of monocrystalline silicon carbide with two cone shaped grains were simulated by coupling the finite element (FEM) and smoothed particle hydrodynamics (SPH) to resolve the mesh distortion problem caused by using the FEM. Twice-scratching experiments were performed under three different conditions to validate the coupled finite element (FE) and SPH model in the scratching simulation with two diamond grits. The experimental results were compared to the simulation results. For twice scratching, the simulation results conform with the experimental results, indicating the validity of the coupled FE and SPH model. Thus, the coupled FE and SPH model was used to simulate the double-scratching process under different conditions. The results of the double-scratching simulation showed that the interference damages in the scratching process occurred under three circumstances: the interference of lateral cracks, the interference of lateral cracks and plastic damage, and the interference of plastic damage. The influence of distance on the interference damage of the two diamond grits in the Y-direction was analysed. The changes in the maximum depth and width in the interference region and the scratching force with the distance of the two grains in the Y-direction are illustrated.

• 出版日期2017-9
• 单位华侨大学