Application of NP(EO)nwith different polymerization degrees in acid bright copper plating

作者：Zhang, Zhen^*; Huang, Jin-Dou

来源：Chinese Journal of Nonferrous Metals, 2017, 27(3): 666-673.

DOI：10.19476/j.ysxb.1004.0609.2017.03.026

• Cathode polarization
• Copper deposition
• Copper foils
• Different effects
• Electric double layer
• Linear sweep voltammetry
• Nonylphenol ethoxylates
• Polymerization degree

To study the reason why nonylphenol ethoxylates (NP(EO)n) can be used as the brightener in acid bright copper plating and effect of NP(EO)nwith different polymerization degrees on kinetic parameters of copper deposition and morphology of deposits, NP-10, NP-15, NP-20 and NP-40 were used with Cl--DPS as additives in CuSO4-H2SO4at 50℃. Adsorption morphology of NP(EO)nin electric double layer on electrode and influence of NP(EO)non electrodeposition were studied by potential scan electrochemical impedance spectroscopy, linear sweep voltammetry and chronoamperometry, respectively. The morphology and crystal orientation of deposits were characterized by scanning electron microscopy and X-ray diffractometry. The results show the adsorption layer of NP(EO)non electrode blocks the diffusion of Cu2+, enhances the cathode polarization and refines the grain size. NP(EO)nshows different effects on electrodeposition due to the different length of hydrophilic chain. In general, the longer the length of NP(EO)nchain, the better the morphology of deposit.

• 出版日期2017-3-1
• 单位华南理工大学