Modeling the Chemical-Mechanical Synergy during Copper CMP

作者：Li, Jing^*; Lu, Xinchun; He, Yongyong; Luo, Jianbin

来源：Journal of the Electrochemical Society, 2011, 158(2): H197-H202.

DOI：10.1149/1.3526320

• MATERIAL-REMOVAL RATE
• ELECTROCHEMICAL RESPONSE
• TRIBOLOGICAL MECHANISMS
• SLIDING WEAR
• FILM WAFERS
• PLANARIZATION
• PAD
• CORROSION
• ABRASION
• CONTACT

Based on the corrosion-wear theory, a mathematical material removal model incorporating both chemical and mechanical effects during chemical-mechanical planarization (CMP) is proposed in this paper. The model not only quantifies the chemical-mechanical synergy, but also isolates each component's contribution to the material removal rate. Synergetic effects on material removal rate are simulated according to the corrosion-wear map. Furthermore, the influences of process parameters and particle size are analyzed. Although the experimental verification has yet to follow, the model predictions are in good agreement with the existing models and published experimental results. In addition, the model will provide an approach for assessing dominant factors in material removal rate during CMP.

• 出版日期2011
• 单位清华大学