Nanoporous Cu wide ribbons with good mechanical integrity

作者：Wang Y M^*; Zhang W; Inoue A

来源：Materials Science and Engineering B-Solid State Materials for Advanced Technology, 2012, 177(7): 532-535.

DOI：10.1016/j.mseb.2011.12.025

• Minor alloying
• Rapid quenching
• Nanoporous copper
• Dealloying

In this work we report the fabrication of nanoporous Cu wide ribbon samples by electrochemical dealloying the minor Si alloyed gamma-Cu30Mn70 solid solution alloys. The gamma-Cu30Mn70 structure was found to be capable of trapping a minor amount of Si as solute by liquid quenching. Ribbon samples of 10 mm wide with tunable thickness were made at the Cu28Mn70Si2 composition. The gamma-Cu28Mn70Si2 alloy can be turned into wide ribbon nanoporous Cu with the pore size of similar to 30-50 nm and with good mechanical integrity. A thin layer of Si-enriched glue structure with similar to 50 nm thickness was formed continuously along the grain boundaries to play the role of reinforcement for the dealloyed structure.

• 出版日期2012-4-25