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摘要
In this paper, the development of a novel manufacturing process is presented for fabricating high-quality AlGaN/GaN high-electron-mobility transistors (HEMTs) on Si (111) substrates. Various material and processing approaches regarding surface passivation, gate oxide, ohmic contact metal, and post-gate annealing are evaluated in terms of device performance. In order to achieve better immunity to current collapse effects, we conducted experiments that investigate the relationship between the AlGaN/GaN HEMTs' electrical characteristics and different passivation films by plasma-enhanced chemical vapour deposition. In order to obtain a better ohmic contact performance, we tested a Ti/Al/Ta/Au ohmic contact metallisation scheme using different annealing temperatures and annealing times to achieve a lower contact resistance, a more proper line edge definition, and a better surface morphology. A post-gate N-2 rapid thermal annealing method done after the gate metallisation process has shown better DC current-voltage output, transfer characteristics, and gate-drain breakdown voltage results compared to the as-fabricated HEMTs. A HEMT with a 0.5-mu m gate length, exhibiting a maximum drain current density of 750 mA/mm, a peak transconductance of 220 mS/mm, a unity-gain cut-off frequency of 24.6 GHz, and a maximum frequency of oscillation of 45.4 GHz, was fabricated using this novel manufacturing process; the X-band power performances demonstrate a 5.8-W/mm output power density and a 51 % power-added efficiency.
- 出版日期2013-7
