Nickel-stabilized hexagonal (Cu, Ni)(6)Sn-5 in Sn-Cu-Ni lead-free solder alloys

作者：Nogita Kazuhiro^*; Nishimura Tetsuro

来源：Scripta Materialia, 2008, 59(2): 191-194.

DOI：10.1016/j.scriptamat.2008.03.002

• intermetallic compound
• solder
• transmission electron microscopy
• phase transformation

Cu6Sn5 is an important intermetallic compound (IMC) in lead-free solder alloys. Cu6Sn5 exists in two crystal structures with an allotropic transformation from monoclinic eta'-Cu6Sn5 at temperatures lower than 186 degrees C to hexagonal eta-Cu6Sn5. A detailed analysis by transmission electron microscopy (TEM) in Sn-0.7 wt.% Cu-0.06 wt.% Ni reveals that when the Ni content in (Cu, Ni)(6)Sn-5 is similar to 9 at.% Ni, the hexagonal allotrope of (Cu, Ni)(6)Sn-5 becomes stable at room temperature.

• 出版日期2008-7