Fabrication of a resin-bonded ultra-fine diamond abrasive polishing tool by electrophoretic co-deposition for SiC processing

作者：Lu, J.^*; Luo, Q. F.; Mao, X. Y.; Xu, X. P.; Wang, Y. H.; Guo, H.

来源：Precision Engineering-journal of the International Societies for Precision Engineering and Nanotechnology, 2017, 47: 353-361.

DOI：10.1016/j.precisioneng.2016.09.009

• Ultra-fine diamond
• Electrophoretic co-deposition
• Polishing tool
• Silicon carbide

A resin-bonded ultra-fine diamond abrasive polishing tool is fabricated by electrophoretic co-deposition (EPcD), and the processing performance of the tool is evaluated in this study. The dispersion stability of suspensions is characterized by a laser particle size analyzer and settlement ratio. The cathodic EPcD of composite powder is realized by adding Al3+ into the suspension. The sintering temperature of composite coatings is determined by differential thermal analysis/thermogravimetry. The surface morphology of the composite coating is observed under a confocal microscope. Results show that uniform, dense, and smooth coatings with diamond and resin particles distributed homogeneously are obtained from the steel substrate. A large (43150 mm) polishing tool with a 20 mu m-thick coating is successfully prepared using the above process. A smooth mirror surface of SiC wafer with a nanoscale roughness (4.3 nm) is achieved after processing with the ultra-fine diamond abrasive polishing tool.

• 出版日期2017-1
• 单位华侨大学