Microstructural investigation on the grain refinement occurring in Cu-doped Ni-Ti thin films

作者：Callisti M^*; Mellor B G; Polcar T

来源：Scripta Materialia, 2014, 77: 52-55.

DOI：10.1016/j.scriptamat.2014.01.021

• Shape memory alloys (SMA)
• Physical vapour deposition (PVD)
• Grain boundary segregation
• Transmission electron microscopy (TEM)

The mechanism of grain refinement in Cu-doped Ni-Ti thin films has been investigated by transmission electron microscopy. Sputter-deposited (Ni,Cu)-rich Ni-Ti Cu thin films exhibited a columnar structure consisting of grains whose lateral size decreased with increasing Cu content. Cu-rich grain boundary segregation was found to become prominent in films containing higher Cu contents. This segregation was attributed to a non-polymorphic crystallization process which lowered the grain growth rate as the Cu content in the films increased.

• 出版日期2014-4-15