Atomic Flux of Cu Diffusion into Sn During Interfacial Interactions Between Cu and Sn Nanoparticles

作者：Mittal Jagjiwan^*; Lin Kwang Lung

来源：Journal of Electronic Materials, 2017, 46(1): 602-608.

DOI：10.1007/s11664-016-4957-8

• Cu
• diffusion
• nanoscale
• Sn
• soldering

Diffusion of Cu inside Sn was studied through interfacial interactions between Cu and Sn nanoparticles without using any soldering additives. The studies conducted in this research revealed that the diffusion of Cu towards Sn nanoparticles was as high as 30 nm and 84 nm, respectively, when the Cu and Sn nanoparticles were heated at 150 degrees C and 210 degrees C under H-2/N-2. The atomic flux of Cu diffusion into the Sn nanoparticles during interfacial reactions at 150 degrees C was higher than that of the Cu diffusion into bulk Sn. High Cu flux resulted in the formation of intermetallic compounds Cu6Sn5 at 150 degrees C and Cu6Sn5 and Cu3Sn at 210 degrees C without an observable diffusion layer.

• 出版日期2017-1